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BoundlessPay
Pre-Seed Round
Past
29 Jan, 23 - 30 Jan, 23
BoundlessPay is a global digital banking app for cross-border collections, payments, and settlements that utilizes blockchain to solve remittance and payment problems.
On January 30, 2023, it was announced that the project successfully raised $80K at $4M valuation from investors in its Pre-Seed Funding Round.
CoinLaunch Score:
Last update:
Medium
15 Jun, 24
BoundlessPay - Pre-Seed Round Overview
start date:
29 Jan, 23
end date:
30 Jan, 23
price:
$0.004
Raise:
$80K
Min. Buy:
N/A
Max. Buy:
N/A
tokens for sale:
20M
Industry:
CeFi
Total Token Issued:
2%
Lock-up:
0% at TGE, 2 months cliff, 12 months linear vesting
BoundlessPay - Pre-Seed Round Round Result
Raise:
$80K
Round FDV:
$4M
Total Raise:
$1.19M
Tokenomics FDV:
$8M
Round Weight:
6.72%
Current FDV:
N/A
BoundlessPay - Pre-Seed Round Funds and Backers
Submit| Fund | Score | Type | Retail ROI | Numbers of investments |
|---|---|---|---|---|
| N/A | 0.00x | 2 |
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