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BoundlessPay
Seed Round
Past
29 Jan - 30 Jan 2023
BoundlessPay is a global digital banking app that provides affordable, fast, and easy-to-use payment services for cross-border collections, payments, and settlements. The app utilizes blockchain and Web3 technology to solve remittance and payment problems, enabling anyone to send, receive, exchange and swap currencies easily.
On January 30, 2023, the project successfully raised $150K at $5M valuation from investors in its Seed Funding Round.
CoinLaunch Score:
Last update:
Low
15 Jun 2024
BoundlessPay - Seed Round Overview
start date:
29 Jan 2023
end date:
30 Jan 2023
price:
$0.025
tokens for sale:
3,000,000
Raise:
$150,000
Min. Buy:
N/A
Max. Buy:
N/A
Industry:
CeFi
Lock-up:
5% at TGE, 2 months cliff, 12 months linear vesting
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