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BoundlessPay
Seed Round
Past
29 Jan, 23 - 30 Jan, 23
BoundlessPay is a global digital banking app that provides affordable, fast, and easy-to-use payment services for cross-border collections, payments, and settlements. The app utilizes blockchain and Web3 technology to solve remittance and payment problems, enabling anyone to send, receive, exchange and swap currencies easily.
On January 30, 2023, the project successfully raised $150K at $5M valuation from investors in its Seed Funding Round.
CoinLaunch Score:
Last update:
Low
15 Jun, 24
BoundlessPay - Seed Round Overview
start date:
29 Jan, 23
end date:
30 Jan, 23
price:
$0.005
Raise:
$150K
Min. Buy:
N/A
Max. Buy:
N/A
tokens for sale:
3M
Industry:
CeFi
Total Token Issued:
0.30%
Lock-up:
5% at TGE, 2 months cliff, 12 months linear vesting
BoundlessPay - Seed Round Round Result
Raise:
$150K
Round FDV:
$5M
Total Raise:
$1.19M
Tokenomics FDV:
$8M
Round Weight:
12.61%
Current FDV:
N/A
BoundlessPay - Seed Round Funds and Backers
Submit| Fund | Score | Type | Retail ROI | Numbers of investments |
|---|---|---|---|---|
| N/A | 0.00x | 1 | ||
| N/A | 0.00x | 1 | ||
| N/A | 0.00x | 1 |
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